|
|
[ÀÌ¹Ì Á¾·áµÈ ±³À°ÀÔ´Ï´Ù.]
3Â÷¿ø ÀüÀÚ±âÀå ÇØ¼® ¹®Á¦¸¦ ºü¸£°í Á¤È®ÇÏ°Ô Ç®±âÀ§ÇØ Æ¯º°È÷ °³¹ßµÈ CST MICROWAVE STUDIO (CST MWS)´Â µð½ºÇ÷¹ÀÌ,¹ÝµµÃ¼, ÄÄÇ»ÅÍ, À¯¹«¼±Åë½Å, ÀÚµ¿Â÷,
À§¼º, ¹Ð¸®Å͸® °ü·Ã Á¦Ç° ¹× ½Ã½ºÅÛ °³¹ß¿¡ Æø³Ð°Ô »ç¿ëµÇ°í ÀÖ½À´Ï´Ù.
º» ±³À°°úÁ¤¿¡¼´Â CST MWSÀÇ FIM ¾Ë°í¸®Áò, Àû¿ë»ç·Ê, ¸ðµ¨¸µ ±â¹ý, Solver¿¡ ´ëÇÑ ÀÌÇØ¸¦ ¹ÙÅÁÀ¸·Î ÇÊÅÍ, È¥¾ÈÅ׳ª, °øÁø±â, PCB ½ÅÈ£¼± ÇØ¼® ¿¹Á¦¸¦ ÁøÇàÇÕ´Ï´Ù. ¶ÇÇÑ CST MWSÀÇ
È¿À²ÀûÀΠȰ¿ëÀ» À§ÇØ Áß¿äÇÑ Post processing templateÀ» ÀÌ¿ëÇÑ ÃÖÀûÈ ¹× ÆÄ¶ó¹ÌÅÍ ½ºÀ§ÇÎ ÇØ¼® °úÁ¤À» ½ÀµæÇϰԵǸç,
Á¤È®ÇÑ °á°ú µµÃâÀ» À§ÇØ Áß¿äÇÑ Mesh ºÐÇÒ ±â¹ýÀ» ÀÍÈ÷°Ô µË´Ï´Ù.
º» °úÁ¤À» Âü¿©ÇÔÀ¸·Î½á CST ÀüÀÚ±âÀå ÇØ¼® Åø¿¡ ´ëÇÑ ÀÌÇØ¿Í Ȱ¿ëÀÇ ÆøÀ» ³ÐÈ÷½Ç ¼ö Àֱ⸦ ¹Ù¶ø´Ï´Ù.
* CD-Key °¡ ÇÑÁ¤µÇ¾î Àֱ⠶§¹®¿¡ ¼µÑ·¯ Á¢¼öÇϽñ⠹ٶø´Ï´Ù.
°úÁ¤¸í |
CST MWS¸¦ ÀÌ¿ëÇÑ ¾ÈÅ׳ª ¹× PCB ÇØ¼® ½Ç½À°úÁ¤ |
±³À°ÀϽà |
2007³â 02¿ù 14ÀÏ(¼ö) ~ 15ÀÏ(¸ñ) / 09:00~18:00 |
±³À°Àå¼Ò |
´ëÀü ICU Áø¸®°ü 1Ãþ RERC ½Ç½À°ÀÇ½Ç |
ÁÖ°ü |
ICU ºÎ¼³ ÀüÆÄ±³À°¿¬±¸¼¾ÅÍ / CST of Korea / Çѱ¹ÀüÀÚÆÄÇÐȸ |
µî·Ï¹æ¹ý |
¿Â¶óÀÎ µî·Ï(http://rerc.icu.ac.kr)
|
µî·Ïºñ |
Çлý 10¸¸¿ø / ÀÏ¹Ý 15¸¸¿ø (±³Àç ¹× Áᫎ Á¦°ø)
|
|
±¸ºÐ
|
ȸ¿ø»ç |
|
µî·Ï±â°£
|
2007³â 01¿ù 05ÀÏ(±Ý) ~ 02¿ù 08ÀÏ(¸ñ)
|
|
µî·Ï¹æ¹ý
|
ȨÆäÀÌÁö(http://rerc.icu.ac.kr)¿¡¼ µî·Ï ⇒ ¾Æ·¡ °èÁ·ΠÀÔ±Ý ⇒
ÀüÈ ¶Ç´Â E-Mail È®ÀÎ ⇒ ¼ö°µî·Ï ¿Ï·á
¡Ø »çÀü µî·Ï¸¸ °¡´ÉÇϸç, ½Ç½À ¶óÀ̼¾½º°¡ ÇÑÁ¤µÈ °ü°è·Î Á¶±â ¸¶°¨
µÉ ¼ö ÀÖÀ¸´Ï ÀüÈ È®ÀÎ ÈÄ µî·ÏÇϽñ⠹ٶø´Ï´Ù.
|
|
µî·Ï¹æ¹ý
|
Çлý 10¸¸¿ø / ÀÏ¹Ý 15¸¸¿ø (±³Àç ¹× Áᫎ Á¦°ø) |
|
ÀÔ±Ýó
|
¿ì¸®ÀºÇà 1002-332-195054 (¿¹±ÝÁÖ : °íÀºÈñ)
|
|
¼¼±Ý°è»ê¼ °ü·Ã
|
°è»ê¼ ¹ßÇàÀÌ ÇÊ¿äÇÑ °æ¿ì ¼Ò¼Ó±â°üÀÇ »ç¾÷ÀÚµî·ÏÁõ »çº»À» Fax ȤÀº
e-mail(kko@icu.ac.kr)·Î º¸³» Áֽñ⠹ٶø´Ï´Ù.
|
|
±âŸ
|
¼÷¹ÚÀº µû·Î Á¦°øÇÏÁö ¾Ê½À´Ï´Ù.
¡Ø ¼÷¹ÚÀÌ ÇÊ¿äÇϽŠºÐÀº À¯¼º±¸Ã» ȨÆäÀÌÁö
(http://www.yuseong.daejeon.kr/)¸¦ Âü°íÇÏ¿© Áֽñ⠹ٶø´Ï´Ù.
|
* ÀÔ±ÝµÈ Âü°¡ºñ´Â ¹ÝȯÇÏÁö ¾Ê½À´Ï´Ù.
 |
|
½Ã °£
|
¹ßÇ¥ ³»¿ë
|
|
Á¦1ÀÏ (2007³â 02¿ù 14ÀÏ)
- CST MWSÀÇ ±âº»±³À° ¹× ¾ÈÅ׳ª, ÇÊÅÍÇØ¼®½Ç½À°úÁ¤
|
|
09:00~11:00
|
3Â÷¿ø ÀüÀÚ±âÀå ½Ã¹Ä·¹ÀÌÅÍ CST MICROWAVE STUDIO(MWS) ¼Ò°³
-
FI(Finite Integration), PBA(Perfect Boundary Approximation),
TST(Thin Sheet Technique), MSS(Multilevel Subgridding
Scheme) ±â¹ý µîÀÇ ¾Ë°í¸®Áò ¼Ò°³
-
°¢Á¾ ÀüÀÚ±âÀå ÇØ¼®»ç·Ê ¼Ò°³ (Antennas, RFID Tag, Couplers, Filters, Planar Structures,
Connectors, EMI/EMC and Package/PCB, SAR problems, LTCC structures, Inductors, Automotive examples)
|
|
11:00~12:00
13:00~14:00
|
±âº» ½Ç½À ±³À°
-
Pre processing °úÁ¤ ½Ç½À (¸ðµ¨¸µ ¹æ¹ý[ACIS kernel V12 äÅÃ], Boolean Operation, History list, ÀçÁú ¹× ¸Þ½¬¼ÂÆÃ, Waveguide, Discret Æ÷Æ® °³³ä ¹× ¼³Á¤¹æ¹ý, ÃÖÀûÈ, ÆÄ¶ó¹ÌÅÍ ½ºÀ§ÇÎ, CAD Àü¿ëÅø°úÀÇ Interface ±â´É, Healing, Macros, ´ÜÃà¾ÆÀÌÄÜ ¼Ò°³)
-
Post processing °úÁ¤ ½Ç½À (1D results : Port Signal, S Parameter, Smith charts, 2D/3D results : E, H Fields, SAR calculation, Farfield calculation)
|
|
14:00~18:00
|
Fractal ¾ÈÅ׳ª ¹× Microstrip FilterÀÇ ¼³°è ¹× ÇØ¼®
-
°í±Þ ¸ðµ¨¸µ ±â¹ýÀ» ÀÌ¿ëÇÑ Fractal ¾ÈÅ׳ª ¹× Microstrip FilterÀÇ ¼³°è ¹× ÇØ¼®
-
ÀçÁú, ¸Þ½¬, Æ÷Æ® ¼³Á¤ ¹× °¢Á¾ ÇØ¼® °á°ú Ãâ·Â
(S parameter, Smith charts, 2D/3D E Field, Farfield µîµî)
-
±¸Á¶ ¹× ¹°¼ºÀ» º¯¼ö·Î ÇÏ¿© ÆÄ¶ó¹ÌÅÍ ½ºÀ§ÇÎ ½Ç½À
(±¸Á¶ÀÇ ±æÀÌ, ¹°¼º°ªÀ» ÆÄ¶ó¹ÌÅÍ·Î ¼³Á¤)
|
|
Á¦2ÀÏ
(2007³â 02¿ù 15ÀÏ) - TransientEMÇØ¼®À» ÀÌ¿ëÇÑ ´Ù¾çÇÑ PCB³ëÀÌÁîÇØ¼® |
|
09:00~11:00
|
CST MWS¸¦ ÀÌ¿ëÇÑ PCB ³ëÀÌÁî ¹× Ä¿Çøµ ÇØ¼® »ç·Ê
-
Power Plane Analysis
- TDR & EYE Simulation
- X-Talk for Stacked CSP & BGA
- Laser Via Transient Analysis
- Differential T-Line Behavior
- Unwanted Behavior of FPCB
- High Speed Meander Pattern
- T-Line Noise Behavior
|
|
09:00~11:00
|
CST MWS¸¦ ÀÌ¿ëÇÑ PCB Transmission Line ÇØ¼® ½Ç½À
- ÇØ¼® Á¶°Ç ¼³Á¤
- Æ÷Æ® ¼³Á¤ / ÇÊµå ¸ð´ÏÅ͸µ / Çʵå Ǫ·çºù / º¼Æ¼Áö ¸ð´ÏÅ͸µ
- ¸Þ½¬ ¼³Á¤ / ¸Þ½¬ ÇÁ·ÎÆÛƼ ¼³Á¤ / ·ÎÄ® ¸Þ½¬ ÇÁ·ÎÆÛƼ ¼³Á¤
- °á°ú ºÐ¼® / ¿¡³ÊÁö ¼ö·Å / ¿¡³ÊÁö ¹ß¶õ½º / Æ÷Æ® ½ÅÈ£ / S-Parameter / Smith Chart
- E-Field Probe / Voltage Monitor / TDR & Eye Simulation / Spice Network Extraction
- Phase¿¡ µû¸¥ 3Â÷¿ø Àü°è º¯È / TimeÀÇ º¯È¿¡ µû¸¥ 3Â÷¿ø Àü°è º¯È /
2Â÷¿ø Àü°è
|
|
11:00~12:00
13:00~16:00
|
FAQ ¹× Q&A
|
|
17:10~
|
¼ö·á½Ä
|
¡Ø À§ÀÇ ³»¿ëÀº ¿¹Á¤»çÇ×À̹ǷΠº¯°æµÉ ¼ö ÀÖ½À´Ï´Ù.
[±³À°ÀÌ Á¾·áµÇ¾ú½À´Ï´Ù.]