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CST MWS¸¦ ÀÌ¿ëÇÑ PCBÀÇ °¢Á¾ ³ëÀÌÁî ÇØ¼® ±â¹ýÀ» Àü´ÞÇÕ´Ï´Ù. ȸ·Î½Ã¹Ä·¹À̼ǰú ¿¬µ¿¿¡ ÇÊ¿äÇÑ SÆÄ¶ó¹ÌÅÍ, SPICEÃßÃâ¿¡¼­ ºÎÅÍ, PCBÀÇ Z º¯È­ºÐ¼®, ½ÅÈ£Àü´Þ, Áö¿¬, ¹Ý»ç, Ä¿Çøµ Ư¼º ºÐ¼®, EMI/C¿Í ESD ÇØ¼® ±×¸®°í TDR/TDT, EYE-diagram ºÐ¼®À» ÅëÇØ PKG, PCB»ó¿¡¼­ ¹ß»ýÇÒ ¼öÀÖ´Â ¸¹Àº ¹®Á¦¸¦ »çÀü Á¡°ËÇÏ°í ºÐ¼®, °³¼±ÇÒ ¼ö ÀÖ½À´Ï´Ù.

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  Á¦¸ñ CST MWS¸¦ ÀÌ¿ëÇÑ PKG,PCBÀÇ SI,PI,EMI/C ÇØ¼®±â¹ý ±³À°(7½Ã°£)
  ±³À°ÀϽà 2007³â 05¿ù 22ÀÏ(È­) / 09:30~17:30
  ±³À°Àå¼Ò CST of Korea »ç³»±³À°Àå (ºÐ´ç¼ÒÀç)>
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  µî·Ï±â°£  2007³â 04¿ù 09ÀÏ(¿ù) ~ 05¿ù 18ÀÏ(±Ý)

  1) CST À¥À̳ª ÀüÈ­·Î µî·Ï
  2) Á¶±â¸¶°¨ °¡´ÉÇÏ¿©, µî·ÏÈ®ÀÎ ¾È³» ¸ÞÀÏÀ̳ª ÀüÈ­¸¦ CST»ç¿¡¼­ ¹ÞÀºÈÄ
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 TEL : 031-781-6866 / FAX :031-781-6864 / E-mail:hjkim@cst-korea.co.kr


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  Á¦1ÀÏ(2007³â 05¿ù 22ÀÏ(È­)) - CST MWS¸¦ ÀÌ¿ëÇÑ PKG, PCBÀÇ SI, PI, EMI/C ÇØ¼®±â¹ý ±³À°
 Part 1
 ¤± 3Â÷¿ø Multilayered PCB ¸ðµ¨¸µ ±â¹ý
  • Cadence APD/Allegro Data·Î 3Â÷¿ø PCB ±¸Á¶ »ý¼ºÇÏ´Â ¹æ¹ý
  • Gerber/DXF Data·Î 3Â÷¿ø PCB±¸Á¶ »ý¼ºÇÏ´Â ¹æ¹ý
 Part 2
 ¤± PCB ½Ã¹Ä·¹ÀÌ¼Ç ±âº» ÆÄ¶ó¹ÌÅÍ ¼³Á¤
  • Æ÷Æ® ÁöÁ¤ ¹æ¹ý
  • Lumped Element (RLC, Diode Á÷º´·Äȸ·Î) »ðÀÔ ¹æ¹ý
  • ICÃøÁ¤ ¹× SPICE ÇØ¼® °á°ú¸¦ Æ÷Æ®¿¡ ÀÔ»ç½ÃŰ´Â ¹æ¹ý
  • Mesh ¼³Á¤ ¹æ¹ý ¹× ÇØ¼®½Ã°£ ´ÜÃàÀ» À§ÇÑ ³ëÇÏ¿ì
  • ½Ã¹Ä·¹ÀÌ¼Ç °á°ú °ËÁõ ¹æ¹ý (¼ö·Åµµ ¹× °á°ú¿¡ ´ëÇÑ ½Å·Ú¼º ÆÇ´Ü ³ëÇÏ¿ì)
 Part 3
 ¤± CST MWSÀÇ PCB SI, PI, EMI/C ¹®Á¦ ÇØ¼® ±â¹ý
  • Signal IntegrityÇØ¼®-TDR/TDT, Z Profile, EYE-Diagram, S-Parameter, SPICE
  • Power Integrity (P/G Power Flow) ÇØ¼®
  • EMI/CÇØ¼®-Near/Far-Field,Radiated SpectrumºÐ¼®(FCC, EMC-Norm)
  • ESD ÇØ¼®-ESD GunÅ×½ºÆ®
 Part 4
 ¤± Full PKG, SIP, PCB¿¡ ´ëÇÑ 3Â÷¿ø ÀüÀÚ±âÀå ÇØ¼®ÇöȲ ¼Ò°³
  • IBM»çÀÇ Full PKG(mesh 6¾ï 5õ¸¸°³) ÇØ¼® »ç·Ê ¼Ò°³
  • HW°¡¼Ó±â(Acceleware»ç¿Í °øµ¿°³¹ß,MWS ÇØ¼®À» ÃÖ´ë7¹è±îÁö Çâ»ó) ¼Ò°³


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