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3Â÷¿ø ÀüÀÚ±âÀå ÇØ¼® ¹®Á¦¸¦ ºü¸£°í Á¤È®ÇÏ°Ô Ç®±âÀ§ÇØ Æ¯º°È÷ °³¹ßµÈ CST MICROWAVE STUDIO (CST MWS)´Â µð½ºÇ÷¹ÀÌ, ¹ÝµµÃ¼, ÄÄÇ»ÅÍ, À¯¹«¼±Åë½Å, ÀÚµ¿Â÷, À§¼º, ¹Ð¸®Å͸® °ü·Ã Á¦Ç° ¹× ½Ã½ºÅÛ
°³¹ß¿¡ Æø³Ð°Ô »ç¿ëµÇ°í ÀÖ½À´Ï´Ù.
À̹ø¿¡ ¼Ò°³ÇØ µå¸®´Â IBM FULL PKG (¸Þ½¬¼ö 6¾ï5õ¸¸°³)¸¦ ÇØ¼®»ç·Ê¸¦ ÅëÇØ¼, CST MWSÀÇ ÇØ¼®
´É·ÂÀ» È®ÀÎÇÏ½Ç ¼ö ÀÖ½À´Ï´Ù.
º» ±³À°°úÁ¤¿¡¼´Â CST MWSÀÇ FIM ¾Ë°í¸®Áò, Àû¿ë»ç·Ê, ¸ðµ¨¸µ ±â¹ý, Solver¿¡ ´ëÇÑ ÀÌÇØ¸¦ ¹ÙÅÁÀ¸·Î
ÇÊÅÍ, ¾ÈÅ׳ª, PCB ½ÅÈ£¼± ÇØ¼® ¿¹Á¦¸¦ ½Ç½ÀÇÏ°Ô µË´Ï´Ù. ¶ÇÇÑ CST MWSÀÇ È¿À²ÀûÀΠȰ¿ëÀ» À§ÇØ
Áß¿äÇÑ ÃÖÀûÈ ¹× ÆÄ¶ó¹ÌÅÍ ½ºÀ§ÇÎ ÇØ¼® ¹æ¹ýÀ» ½ÀµæÇϰԵǸç, Á¤È®ÇÑ °á°ú µµÃâÀ» À§ÇØ Áß¿äÇÑ
Mesh ºÐÇÒ ±â¹ýÀ» ÀÍÈ÷°Ô µË´Ï´Ù.
º» °úÁ¤À» Âü¿©ÇÔÀ¸·Î½á CST ÀüÀÚ±âÀå ÇØ¼® Åø¿¡ ´ëÇÑ ÀÌÇØ¿Í Ȱ¿ëÀÇ ÆøÀ» ³ÐÈ÷½Ç ¼ö Àֱ⸦ ¹Ù¶ø´Ï´Ù.
* CD-Key °¡ ÇÑÁ¤µÇ¾î Àֱ⠶§¹®¿¡ ¼µÑ·¯ Á¢¼öÇϽñ⠹ٶø´Ï´Ù.
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½Ã °£
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¹ßÇ¥ ³»¿ë
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Á¦1ÀÏ(2007³â 05¿ù 03ÀÏ(¸ñ))
- CST MWS¸¦ ÀÌ¿ëÇÑ ¾ÈÅ׳ª, ÇÊÅÍÇØ¼® ½Ç½À°úÁ¤(±âº»±³À°)
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10:00~11:00
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3Â÷¿ø ÀüÀÚ±âÀå ½Ã¹Ä·¹ÀÌÅÍ CST MICROWAVE STUDIO(MWS)¼Ò°³
- FI(Finite Integration), PBA(Perfect Boundary Approximation), TST(Thin Sheet Technique), MSS(Multilevel Subgridding Scheme) ±â¹ý µîÀÇ ¾Ë°í¸®Áò ¼Ò°³
- °¢Á¾ ÀüÀÚ±âÀå ÇØ¼®»ç·Ê ¼Ò°³ (Antennas, RFID Tag, Couplers, Filters, Planar Structures, Connectors, EMI/EMC and Package/PCB, SAR problems, LTCC structures, Inductors, Automotive examples)
- DESIGN STUDIO(ȸ·Î+3D ÀüÀÚ±âÀå °áÇÕ ÇØ¼® °¡´É)¸¦ ÀÌ¿ëÇÑ ¾ÈÅ׳ª ÀÓÇÇ´ø½º
¸ÅĪ ¹æ¹ý
- PBG ±¸Á¶¿¡¼ÀÇ Reflection Diagram °è»ê Macro
- PBA, FPBA ¸¦ ÀÌ¿ëÇÑ ¸ð¹ÙÀÏ Æù ÇØ¼® »ç·Ê ¼Ò°³
(¿ÜºÎ CADµ¥ÀÌÅÍ¿ÍÀÇ ¿Ïº®ÇÑ È£È¯¼º:°¢ ºÎºÐº° ÃÖÀû¸Þ½¬ ÀÚµ¿ÁöÁ¤)
- Time Domain (Transient) Solver ¼Ò°³
- °Å´ë ±¸Á¶ ÇØ¼®À» À§ÇÑ Integral Equation Solver ¼Ò°³ (Ç×°ø±â µîÀÇ RCS ÇØ¼®)
- °øÁø ±¸Á¶Çؼ®À» À§ÇÑ Eigenmode Solver ¼Ò°³
- Frequency Domain Solver ¼Ò°³
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11:00~12:00
13:00~14:00
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¸ðµ¨¸µ ¹× ÇØ¼®°úÁ¤ ½Ç½À
- Pre processing °úÁ¤ ½Ç½À
(¸ðµ¨¸µ ¹æ¹ý: Boolean Operation, History list, ÀçÁú ¹× ¸Þ½¬¼ÂÆÃ, Waveguide, Discret Æ÷Æ® °³³ä ¹× ¼³Á¤¹æ¹ý, ÃÖÀûÈ, ÆÄ¶ó¹ÌÅÍ ½ºÀ§ÇÎ, CAD Àü¿ëÅø°úÀÇ Interface ±â´É, Healing, Macros, ´ÜÃà¾ÆÀÌÄÜ ¼Ò°³)
- Post processing °úÁ¤ ½Ç½À
(1D results : Port Signal, S Parameter, Smith charts, 2D/3D results : E, H Fields, SAR calculation, Farfield calculation)
- °í±Þ ¸ðµ¨¸µ ±â¹ý
Pick point¸¦ ÀÌ¿ëÇÑ ¸ðµ¨¸µ, Array ±¸Á¶ »ý¼º, 2D curve¸¦ ÀÌ¿ëÇÑ 3D ¸ðµ¨¸µ,
±¸Á¶ÀÇ ³»ºÎ Shell ±â´É, ÀÓÀÇÀÇ ´Ü¸é ÄÆÆÃÀ» À§ÇÑ Slice ±â´É ½Ç½À
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14:00~17:00
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Fractal ¾ÈÅ׳ª ¹× Microstrip FilterÀÇ ¼³°è ¹× ÇØ¼®
- °í±Þ ¸ðµ¨¸µ ±â¹ýÀ» ÀÌ¿ëÇÑ Fractal ¾ÈÅ׳ª ¹× Microstrip FilterÀÇ ¼³°è ¹× ÇØ¼®
- ÀçÁú, ¸Þ½¬, Æ÷Æ® ¼³Á¤ ¹× °¢Á¾ ÇØ¼® °á°ú Ãâ·Â
(S parameter, Smith charts, 2D/3D E Field, Farfield µîµî)
- ±¸Á¶ ¹× ¹°¼ºÀ» º¯¼ö·Î ÇÏ¿© ÆÄ¶ó¹ÌÅÍ ½ºÀ§ÇÎ ½Ç½À
(±¸Á¶ÀÇ ±æÀÌ, ¹°¼º°ªÀ» ÆÄ¶ó¹ÌÅÍ·Î ¼³Á¤)
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Á¦2ÀÏ(2007³â 05¿ù 04ÀÏ(±Ý))
- Transient EMÇØ¼®À» ÀÌ¿ëÇÑ ´Ù¾çÇÑ PCB ³ëÀÌÁî ÇØ¼®
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10:00~11:00
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HW°¡¼Ó±â (Acceleware, CST °øµ¿°³¹ß)-CST MWSÇØ¼®¼Óµµ 7¹è Çâ»ó
IBM Full PKG(mesh 6¾ï5õ¸¸°³) ÇØ¼® ¼º°ø»ç·Ê ¼Ò°³
LTCC ÇØ¼®»ç·Ê
Gerber Mulitilayers Import ¼Ò°³ (PCB Interface)
CST MWS¸¦ ÀÌ¿ëÇÑ PCB ³ëÀÌÁî ¹× Ä¿Çøµ ÇØ¼® »ç·Ê ¼Ò°³
- Power Plane Analysis
- TDR & EYE Simulation
- X-Talk for Stacked CSP & BGA
- Laser Via Transient Analysis
- Differential T-Line Behavior
- Unwanted Behavior of FPCB
- High Speed Meander Pattern
- T-Line Noise Behavior
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11:00~12:00
13:00~15:30
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CST MWS ¸Þ½¬ ¼³Á¤ ¹æ¹ý
CST MWS¸¦ ÀÌ¿ëÇÑ PCB Transmission LineÇØ¼®½Ç½À
- ÇØ¼® Á¶°Ç ¼³Á¤
- Æ÷Æ® ¼³Á¤ / ÇÊµå ¸ð´ÏÅ͸µ / Çʵå Ǫ·çºù / º¼Æ¼Áö ¸ð´ÏÅ͸µ
- ¸Þ½¬ ¼³Á¤ / ¸Þ½¬ ÇÁ·ÎÆÛƼ ¼³Á¤ / ·ÎÄ® ¸Þ½¬ ÇÁ·ÎÆÛƼ ¼³Á¤
- °á°ú ºÐ¼® / ¿¡³ÊÁö ¼ö·Å / ¿¡³ÊÁö ¹ß¶õ½º / Æ÷Æ® ½ÅÈ£ / S-Parameter / Smith Chart
- E-Field Probe / Voltage Monitor / TDR & Eye Simulation / Spice Network Extraction
- Phase¿¡ µû¸¥ 3Â÷¿ø Àü°è º¯È / TimeÀÇ º¯È¿¡ µû¸¥ 3Â÷¿ø Àü°è º¯È /
2Â÷¿ø Àü°è
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15:30~17:00
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FAQ ¹× Q&A
- Æò¼Ò °¡Àå ¸¹ÀÌ ³ª¿À´Â Áú¹®¿¡ ´ëÇÑ FAQ ¹× ±³À° ¶Ç´Â Æò¼Ò Åø »ç¿ëÇϸé¼
±Ã±ÝÇß´ø °Í¿¡ ´ëÇÑ ÁúÀÇ ÀÀ´ä
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17:10~18:00
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