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2009.08.27(¸ñ)
~ 28(±Ý) 2Àϰ£ |
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Çѱ¹°úÇбâ¼ú¿ø(KAIST)
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ÀÏ¹Ý 130,000¿ø /
Çлý 80,000¿ø (±³Àç ¹× Áß½ÄÁ¦°ø)
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RERC
Tel) 042-866-6263, 6265
/ Fax) 042-866-6227 / e-mail)
mulran@icu.ac.kr |
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- CSTÇѱ¹Áö»ç À±Çö¼ö ´ë¸®
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10:00~17:00
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Microstrip + SMA connector
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(S-parameter, SPICE netlist, TDR, EYE ÃßÃâ ¹æ¹ý)
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¤± ÀÓÀÇ Time signal(ICÃøÁ¤ ¶Ç´Â SPICE tran. ÇØ¼®°á°ú) Àΰ¡½ÃÀÇ ½ÅÈ£Àü´Þ
¤± ÀÓÀÇ Time signal(ICÃøÁ¤ ¶Ç´Â SPICE tran. ÇØ¼®°á°ú) Àΰ¡½ÃÀÇ PCB¿¡¼
¹ß»ýµÈ EMC-norm(FCC Class A, B) ÃßÃ⠽ǽÀ
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¤± °æ°èÁ¶°Ç, Æ÷Æ®¼³Á¤ ¹æ¹ý ¹× MESH ±â¹ý±³À°
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(2009³â 08¿ù 28ÀÏ,
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10:00~17:00
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Metalic ShieldÀÇ ÀüÀÚÆÄ
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(Time domain farfield probe¸¦ ÀÌ¿ëÇÑ Shielding effectiveness
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¤± Signal Integrity in a Shielded Myltipin Connector
(Cross Talk, TDR, EYE ̧̉))
¤± Power Integrity (Decoupling Capacitor È¿°ú)
¤± ESD GUNÀ» ÀÌ¿ëÇÑ PCB ½Ã½ºÅÛÀÇ ESD ÇØ¼® ½Ç½À
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