|
|
[ÀÌ¹Ì Á¾·áµÈ ±³À°ÀÔ´Ï´Ù.]
[Á¤±â±³À°-Á¦2Â÷]
CST MWS¸¦ ÀÌ¿ëÇÑ SI/PI, EMC/I, ESD ÇØ¼®±â¹ý ½Ç½À±³À°
ÀϽà : 2010³â 03¿ù 18ÀÏ(¸ñ)~19ÀÏ(±Ý)
Àå¼Ò : °æ±âµµ ºÐ´ç "CSTÇѱ¹Áö»ç"
ÁÖÃÖ : CSTÇѱ¹Áö»ç

CSTÇѱ¹Áö»ç¿¡¼CST MWS¸¦ ÀÌ¿ëÇÑ ÇØ¼®±â¹ý(1ÀÎ 1PC)½Ç½À°úÁ¤À» °³¼³Çϰí ÀÖ½À´Ï´Ù. °ü½ÉÀÖ´Â ºÐµéÀÇ ¸¹Àº Âü¿© ºÎŹ µå¸³´Ï´Ù.
±³À°ÀϽà |
2010.03.18(¸ñ)
~ 19(±Ý) 2Àϰ£ |
±³À°Àå¼Ò |
CSTÇѱ¹Áö»ç
(°æ±âµµ ¼º³²½Ã ºÐ´ç±¸ ºÐ´çµ¿ 173-2¹øÁö
Áø½ººôµù 4Ãþ) |
µî·Ï¹æ¹ý
|
ȨÆäÀÌÁöµî·Ï
|
µî·Ï±â°£
|
2010.02.18(¸ñ)
~ 03.12(±Ý) 15ÀÎ ¼±Âø¼ø ¸¶°¨ |
µî·Ïºñ |
À¯Áöº¸¼öü°á °í°´ : ¹«·á
À¯Áöº¸¼ö¹Ìü°á°í°´ : ÀÏ¹Ý 11¸¸¿ø,Çлý 11¸¸¿ø, ºñ°í°´ 33¸¸¿ø(VATÆ÷ÇÔ)
¹«·áÁÖÂ÷,
±³Àç, Áᫎ ¹× À½·á Á¦°ø
±³À°ºñÀԱݰèÁ :¿ÜȯÀºÇà
297-22-00505-6 ¿¹±ÝÁÖ:(ÁÖ)¾¾¿¡½ºÆ¼¿ÀºêÄÚ¸®¾Æ
*±³À°ºñÀԱݱîÁö
¿Ï·áµÇ¾î¾ß ¼ö°½ÅûÀÌ Á¾·áµÇ¿À´Ï, ÀԱݻç½ÇÀ»
²À È®ÀÎ
¹ÞÀ¸½Ã±â ¹Ù¶ø´Ï´Ù.
¼¼±Ý°è»ê¼
¹ßÇàÀÌ ÇÊ¿äÇϽŠºÐ : ±³À°ºñ¸¦ ÀÔ±ÝÇϽðí, ¸ÞÀÏ·Î
»ç¾÷ÀÚµî·Ï
Áõ »çº»À» º¸³»Áֽñ⠹ٶø´Ï´Ù. ÀüÀÚ¼¼±Ý°è»ê¼±³ºÎ´Â
±³À°ÀÌ Á¾·áµÈ ÀÌ
ÈÄ¿¡ Àϰý ¼ÛºÎµË´Ï´Ù. |
µî·Ï¹®ÀÇ |
CSTÇѱ¹Áö»ç
±èÇöÁÖ 031-781-6866 | hjkim@cst-korea.co.kr |
 |
|
½Ã °£
|
±³À° ³»¿ë
|
|
Á¦1ÀÏ
(2010³â 03¿ù 18ÀÏ, ¸ñ¿äÀÏ)
- CSTÇѱ¹Áö»ç À±Çö¼ö ´ë¸®
|
|
10:00~17:00
|
¤±
Microstrip + SMA connector
±¸Á¶ ¸ðµ¨¸µ
(S-parameter, SPICE netlist, TDR, EYE ÃßÃâ ¹æ¹ý)
¤± Differential Via Pair
(DS ¿¬µ¿ÇÏ¿© EYE pattern ÃßÃâ ¹æ¹ý)
¤± °æ°èÁ¶°Ç ¼³Á¤ ¹× ÇØ¼® Flow ¿¡ ´ëÇÑ ¼³¸í
¤± ÀÓÀÇ Time signal(ICÃøÁ¤ ¶Ç´Â SPICE tran. ÇØ¼®°á°ú) Àΰ¡½ÃÀÇ ½ÅÈ£Àü´Þ
¤± ÀÓÀÇ Time signal(ICÃøÁ¤ ¶Ç´Â SPICE tran. ÇØ¼®°á°ú) Àΰ¡½ÃÀÇ PCB¿¡¼
¹ß»ýµÈ EMC-norm(FCC Class A, B) ÃßÃ⠽ǽÀ
¤± ½Ã¹Ä·¹ÀÌ¼Ç °á°ú °ËÁõ¹æ¹ý ¹× È¿À²ÀûÀÎ ÇØ¼® ¹æ¹ý
¤± °æ°èÁ¶°Ç, Æ÷Æ®¼³Á¤ ¹æ¹ý ¹× MESH ±â¹ý±³À°
|
|
Á¦2ÀÏ
(2010³â 03¿ù 19ÀÏ,
±Ý¿äÀÏ) - CSTÇѱ¹Áö»ç ¹Ú¼º¿í
´ë¸®
|
|
10:00~17:00
|
¤±
Metalic ShieldÀÇ ÀüÀÚÆÄ
Â÷ÆóÈ¿°ú °ËÁõ ½Ç½À
(Time domain farfield probe¸¦ ÀÌ¿ëÇÑ Shielding effectiveness
̧̉)
¤± Signal Integrity in a Shielded Myltipin Connector
(Cross Talk, TDR, EYE ̧̉))
¤± Power Integrity (Decoupling Capacitor È¿°ú)
¤± ESD GUNÀ» ÀÌ¿ëÇÑ PCB ½Ã½ºÅÛÀÇ ESD ÇØ¼® ½Ç½À
|
¡Ø À§ÀÇ ³»¿ëÀº ¿¹Á¤»çÇ×À̹ǷΠº¯°æµÉ ¼ö ÀÖ½À´Ï´Ù.
|
|