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CST MWS¸¦ ÀÌ¿ëÇÑ SI/PI, EMC/I, ESD ÇØ¼®±â¹ý ½Ç½À±³À°
ÀϽà : 2010³â 08¿ù 11ÀÏ(¼ö)~12ÀÏ(¸ñ)
Àå¼Ò : °æ±âµµ ºÐ´ç "CSTÇѱ¹Áö»ç"
ÁÖÃÖ : CSTÇѱ¹Áö»ç

CSTÇѱ¹Áö»ç¿¡¼CST MWS¸¦ ÀÌ¿ëÇÑ ÇØ¼®±â¹ý(1ÀÎ 1PC)½Ç½À°úÁ¤À» °³¼³Çϰí ÀÖ½À´Ï´Ù. °ü½ÉÀÖ´Â ºÐµéÀÇ ¸¹Àº Âü¿© ºÎŹ µå¸³´Ï´Ù.
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2010.08.11(¼ö)
~ 12(¸ñ) 2Àϰ£ |
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CSTÇѱ¹Áö»ç
(°æ±âµµ ¼º³²½Ã ºÐ´ç±¸ ºÐ´çµ¿ 173-2¹øÁö
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2010.07.09 ~ 07.31 18ÀÎ ¼±Âø¼øÀ¸·Î Á¶±â¸¶°¨ÀÌ µÉ ¼ö ÀÖ½À´Ï´Ù.) |
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CSTÇѱ¹Áö»ç
±èÇöÁÖ 031-781-6866 | hjkim@cst-korea.co.kr |
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- CSTÇѱ¹Áö»ç À±Çö¼ö °úÀå
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10:00~17:00
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Microstrip + SMA connector
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(S-parameter, SPICE netlist, TDR, EYE ÃßÃâ ¹æ¹ý)
¤± Differential Via Pair
(DS ¿¬µ¿ÇÏ¿© EYE pattern ÃßÃâ ¹æ¹ý)
¤± °æ°èÁ¶°Ç ¼³Á¤ ¹× ÇØ¼® Flow ¿¡ ´ëÇÑ ¼³¸í
¤± ÀÓÀÇ Time signal(ICÃøÁ¤ ¶Ç´Â SPICE tran. ÇØ¼®°á°ú) Àΰ¡½ÃÀÇ ½ÅÈ£Àü´Þ
¤± ÀÓÀÇ Time signal(ICÃøÁ¤ ¶Ç´Â SPICE tran. ÇØ¼®°á°ú) Àΰ¡½ÃÀÇ PCB¿¡¼
¹ß»ýµÈ EMC-norm(FCC Class A, B) ÃßÃ⠽ǽÀ
¤± ½Ã¹Ä·¹ÀÌ¼Ç °á°ú °ËÁõ¹æ¹ý ¹× È¿À²ÀûÀÎ ÇØ¼® ¹æ¹ý
¤± °æ°èÁ¶°Ç, Æ÷Æ®¼³Á¤ ¹æ¹ý ¹× MESH ±â¹ý±³À°
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Á¦2ÀÏ
(2010³â 08¿ù 12ÀÏ,
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10:00~17:00
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Metalic ShieldÀÇ ÀüÀÚÆÄ
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¤± Signal Integrity in a Shielded Myltipin Connector
(Cross Talk, TDR, EYE ̧̉))
¤± Power Integrity (Decoupling Capacitor È¿°ú)
¤± ESD GUNÀ» ÀÌ¿ëÇÑ PCB ½Ã½ºÅÛÀÇ ESD ÇØ¼® ½Ç½À
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